01How the process works
Solder paste is printed through a stencil, components are placed by pick and place machines and the board is reflow soldered. Through hole parts are wave or selective soldered. Automated optical inspection (AOI), X-ray for BGAs, in-circuit and functional tests follow.
Most defects start at paste printing. Component traceability, moisture sensitive device handling and ESD protection are process controls auditors look for, alongside workmanship to IPC-A-610.
- Solder paste printing. Paste printed and inspected (SPI).
- Placement. Components placed by machine.
- Reflow. Controlled temperature profile.
- Inspection. AOI, X-ray, manual to IPC-A-610.
- Testing. ICT, functional test, conformal coat.
02What typically goes wrong
| Defect | Typical cause | How it is found |
|---|---|---|
| Solder bridges | Paste volume, stencil | AOI |
| Insufficient solder and opens | Printing, coplanarity | AOI, X-ray, ICT |
| Tombstoning | Pad design, reflow | AOI |
| BGA voids | Profile, paste | X-ray |
| Wrong or reversed components | Feeder set-up | AOI, first article |
| ESD damage | Handling | Functional test, audit |
03Where an inspector should look
Before production
- Gerber, BOM and first article
- Stencil and reflow profile
- MSD and ESD controls
During production
- SPI and AOI results
- Reflow profile checks
After production
- IPC-A-610 visual sampling
- Functional test results
- Packaging (ESD, moisture)
04Standards and references
IPC-A-610 (acceptability of electronic assemblies), IPC J-STD-001 (soldering), IPC-7711/7721 (rework), IEC 61340-5-1 (ESD).
Standards are named for orientation. The applicable edition and acceptance criteria are those in your contract and specification.